There is disclosed a high density test probe assembly, and method of fabricating it. The probe assembly has a multitude of wire-like probe elements whose exposed tips are spaced on centers X and Y to match the centers of closely spaced surface pads of a VLSI circuit. Interconnections to and from the...http://www.google.de/patents/US5225777?utm_source=gb-gplus-sharePatent US5225777 - High density probe
