The invention relates to a method of transferring useful layers from a donor wafer which includes a multi-layer structure on the surface of the donor wafer that has a thickness sufficient to form multiple useful layers for subsequent detachment. The layers may be formed of materials having sufficiently...http://www.google.de/patents/US7256075?utm_source=gb-gplus-sharePatent US7256075 - Recycling of a wafer comprising a multi-layer structure after taking-off a thin layer
