A semiconductor integrated circuit package is provided with insulated bonding wires. The semiconductor die is mounted to a base of either a leadframe or a grid-array package. A plurality of bonding wires are bonded between bonding pads on the semiconductor die and bonding fingers at inner ends of package...http://www.google.de/patents/US6033937?utm_source=gb-gplus-sharePatent US6033937 - S.sub.i O.sub.2 wire bond insulation in semiconductor assemblies
