A microcap wafer-level package is provided in which a micro device is connected to bonding pads on a base wafer. A peripheral pad on the base wafer encompasses the bonding pads and the micro device. A cap wafer has gaskets formed thereon using a thick photoresist semiconductor photolithographic process....http://www.google.de/patents/US6376280?utm_source=gb-gplus-sharePatent US6376280 - Microcap wafer-level package
