A structure and method for making copper interconnections in an integrated circuit are described. The structure is a damascene copper connector whose upper surface is coplanar with the upper surface of the insulating layer in which it is embedded. Out-diffusion of copper from the connector is prevented...http://www.google.de/patents/US5744376?utm_source=gb-gplus-sharePatent US5744376 - Method of manufacturing copper interconnect with top barrier layer
