A circuit board consisting of an insulating substrate, a die bonding pad for fixedly bonding a semiconductor element onto the insulating substrate, and a wiring layer, in such a manner that the die bonding pad and wire layer are formed on the insulating substrate. A first heat conducting/radiating layer...http://www.google.de/patents/US5500785?utm_source=gb-gplus-sharePatent US5500785 - Circuit board having improved thermal radiation
