To dry semiconductor substrates, especially silicon wafers subsequent to rinsing after etching, the substrate is exposed to the action of radiation which contains an IR portion and a UV portion, the IR portion being greater than the UV portion. The IR-UV radiation quickly dries the substrate and prevents...http://www.google.de/patents/US6016612?utm_source=gb-gplus-sharePatent US6016612 - Process and device for drying of substrates
