A process which provides for self-aligned contact hole filling leading to complete planarization and low contact resistance at the same time, without the use of additional lithographic masking procedures is described. Further, the resultant conductive plug eliminates spiking problems between aluminum...http://www.google.de/patents/US4966868?utm_source=gb-gplus-sharePatent US4966868 - Process for selective contact hole filling including a silicide plug
