An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mounted in a prober. The PCIA comprises...http://www.google.de/patents/US7382142?utm_source=gb-gplus-sharePatent US7382142 - High density interconnect system having rapid fabrication cycle
