The present invention is directed to an improved system for inspection of microelectronic assemblies, including chips and interconnection elements such as wires, ball bonds, and wedge bonds contained therein. This system includes a high speed illumination subsystem, a dual magneification video camera...http://www.google.de/patents/US5424838?utm_source=gb-gplus-sharePatent US5424838 - Microelectronics inspection system
