A semiconductor package includes an SOI wafer having a first side including an integrated circuit system, and a second side, opposite the first side, forming at least one cavity. At least one chip or component is placed in the cavity. An optical through via is formed through a buried oxide which optically...http://www.google.de/patents/US7489025?utm_source=gb-gplus-sharePatent US7489025 - Device and method for fabricating double-sided SOI wafer scale package with optical through via connections
