A copper electroplating composition for integrated circuit interconnection is proposed, including a copper salt, an inorganic acid containing same anion as the copper salt, a suppressing agent and a polishing agent. This electroplating composition helps deposit copper into fine trenches with a high aspect...http://www.google.de/patents/US20020195351?utm_source=gb-gplus-sharePatent US20020195351 - Copper electroplating composition for integrated circuit interconnection
