Disclosed are embodiments of an improved high aspect ratio electroplated metal structure (e.g., a copper or copper alloy interconnect, such as a back end of the line (BEOL) or middle of the line (MOL) contact) in which the electroplated metal fill material is free from seams and/or voids. Also, disclosed...http://www.google.de/patents/US7951714?utm_source=gb-gplus-sharePatent US7951714 - High aspect ratio electroplated metal feature and method
