A tape ball grid array package and a method of fabricating the package. A dielectric tape having a metallic layer on both sides is provided. The metallic layers are patterned to form circuits. A plurality of via holes is formed in the dielectric tape. The via holes pass through the lower metallic layer...http://www.google.de/patents/US6779783?utm_source=gb-gplus-sharePatent US6779783 - Method and structure for tape ball grid array package
