A method of making a multi-chip electronic package which utilizes an organic, laminate chip carrier and a pair of semiconductor chips positioned on an upper surface of the carrier in a stacked orientation. The organic, laminate chip carrier is comprised of a plurality of conductive planes and dielectric...http://www.google.de/patents/US7665207?utm_source=gb-gplus-sharePatent US7665207 - Method of making a multi-chip electronic package having laminate carrier
