A method and apparatus for testing a singularized semiconductor die prior to packaging the die, thereby allowing for the packaging or other use of only known good die. The apparatus employs a housing of ceramic or other workable material. Contact pads on the interior of the package are coupled to exterior...http://www.google.de/patents/US5424652?utm_source=gb-gplus-sharePatent US5424652 - Method and apparatus for testing an unpackaged semiconductor die
