In the fabrication of integrated circuits, one specific technique for making surfaces flat is chemical-mechanical planarization. However, this technique is quite time consuming and expensive, particularly as applied to the numerous intermetal dielectric layers—the insulative layers sandwiched between...http://www.google.de/patents/US7235865?utm_source=gb-gplus-sharePatent US7235865 - Methods for making nearly planar dielectric films in integrated circuits
