A cleaner composition for removing from within a microelectronic fabrication a copper containing residue layer in the presence of a copper containing conductor layer, and a method for stripping from within a microelectronic fabrication the copper containing residue layer in the presence of the copper...http://www.google.de/patents/US6123088?utm_source=gb-gplus-sharePatent US6123088 - Method and cleaner composition for stripping copper containing residue layers
