Heat is conducted, from a heat generating electronic device that is mounted in a gap between a circuit board and a heat dissipator, along a path that includes a path segment that passes along conductive runs on the circuit board and another segment that spans the gap at a location adjacent to the device,...http://www.google.de/patents/US6483706?utm_source=gb-gplus-sharePatent US6483706 - Heat dissipation for electronic components
