A method is disclosed of repairing wire bond damage on semiconductor chips such as high speed semiconductor microprocessors, application specific integrated circuits (ASICs), and other high speed integrated circuit devices, particularly devices using low-K dielectric materials. The method involves surface...http://www.google.de/patents/US7517790?utm_source=gb-gplus-sharePatent US7517790 - Method and structure to enhance temperature/humidity/bias performance of semiconductor devices by surface modification
