A printed circuit architecture includes a relatively thick, stiffening base of thermally and electrically conductive material, and a laminate of conductive layers including a printed circuit structure, interleaved with dielectric layers, disposed atop the base. The patterned conductive layers contain...http://www.google.de/patents/US6681483?utm_source=gb-gplus-sharePatent US6681483 - Multi-layer RF printed circuit architecture with low-inductance interconnection and low thermal resistance for wide-lead power devices
