The present invention provides a method and apparatus for achieving conformal step coverage on a substrate by ionized metal plasma deposition. A target provides a source of material to be sputtered and ionized by a plasma maintained by a coil. The ionized material is deposited on the substrate that is...http://www.google.de/patents/US20010050220?utm_source=gb-gplus-sharePatent US20010050220 - METHOD AND APPARATUS FOR PHYSICAL VAPOR DEPOSITION USING MODULATED POWER
