The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides...http://www.google.de/patents/US6932679?utm_source=gb-gplus-sharePatent US6932679 - Apparatus and method for loading a wafer in polishing system
