An integrated circuit device may include a substrate, a conductive pad on a surface of the substrate, and a conductive line on the surface of the substrate. Moreover, the conductive line may be connected to the conductive pad, and the conductive line may be narrow relative to the conductive pad. In addition,...http://www.google.de/patents/US7531898?utm_source=gb-gplus-sharePatent US7531898 - Non-Circular via holes for bumping pads and related structures
