The present invention is directed toward methods and apparatuses for encapsulating a microelectronic die or another type of microelectronic device. One aspect of the present invention is directed toward packaging a microelectronic die that is attached to either a first surface or a second surface of...http://www.google.de/patents/US6677675?utm_source=gb-gplus-sharePatent US6677675 - Microelectronic devices and microelectronic die packages
