A submount for a light emitting device package includes a rectangular substrate. A first bond pad and a second bond pad are on a first surface of the substrate. The first bond pad includes a die attach region offset toward a first end of the substrate and configured to receive a light emitting diode...http://www.google.de/patents/US7964888?utm_source=gb-gplus-sharePatent US7964888 - Semiconductor light emitting device packages and methods
