A method is provided for the solder-stop structuring of elevations on wafers, such as 3D contact structures in the form of resilient or compliant contact bumps, which are connected electrically via a metallization layer to a bonding pad on the wafer, the metallization layer extending over the 3D structure...http://www.google.de/patents/US20040087131?utm_source=gb-gplus-sharePatent US20040087131 - Method for the solder-stop structuring of elevations on wafers
