This application discloses a new and improved thermal ink jet printhead and method of manufacture wherein a tape automated bond (TAB) flexible circuit is sequentially thermosonically bonded in a one-by-one wire bonding process to aligned conductive traces on a thin film resistor substrate. These traces...http://www.google.de/patents/US4827294?utm_source=gb-gplus-sharePatent US4827294 - Thermal ink jet printhead assembly employing beam lead interconnect circuit
