After a trench 54 is formed in a conductive foil 60, the circuit elements are mounted, and the insulating resin is applied on the conductive foil 60 as the support substrate. After being inverted, the conductive foil 60 is polished on the insulating resin 50 as the support substrate for separation into...http://www.google.de/patents/US7091606?utm_source=gb-gplus-sharePatent US7091606 - Circuit device and manufacturing method of circuit device and semiconductor module
