This invention provides a method for manufacturing a three-dimensional circuit substrate. In the method, a conducting portion comprising a circuit pattern is formed on the surface of a film. The film is placed over a resin board in a mold in which the conducting portion of the film is opposed to the...http://www.google.de/patents/US5090122?utm_source=gb-gplus-sharePatent US5090122 - Method for manufacturing a three-dimensional circuit substrate
