A process for forming a layer of a metallurgy interconnection system on a substrate. The process involves forming a first electrically insulative layer of an organic polymerized resin material on the substrate, forming a second thin layer on the first layer which is resistant to dry etching conditions...http://www.google.de/patents/US4307179?utm_source=gb-gplus-sharePatent US4307179 - Planar metal interconnection system and process
