A method of recovering a first substrate, including the steps of: sticking a second substrate on a semiconductor layer epitaxially grown on the first substrate; and separating the semiconductor layer and the first substrate. Furthermore, a method of reproducing a first substrate, including the step of...http://www.google.de/patents/US7713878?utm_source=gb-gplus-sharePatent US7713878 - Method of recovering and reproducing substrates and method of producing semiconductor wafers
