A system for polishing a semiconductor wafer, the system comprising a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen subassembly defining a polishing area, and a polishing head selectively...http://www.google.de/patents/US6120347?utm_source=gb-gplus-sharePatent US6120347 - System for real-time control of semiconductor wafer polishing
