Method and structures are provided for conformal lining of dual damascene structures in integrated circuits. Preferred embodiments are directed to providing conformal lining over openings formed in porous materials. Trenches are formed in, preferably, insulating layers. The layers are then adequately...http://www.google.de/patents/US7498242?utm_source=gb-gplus-sharePatent US7498242 - Plasma pre-treating surfaces for atomic layer deposition
