A method for forming a conductive via or through-wafer interconnect (TWI) in a semiconductive substrate for use as a contact card, test connector, semiconductor package interposer, or die interconnect includes the acts of (a) forming an oxide or nitride layer on both sides of the substrate, (b) forming...http://www.google.de/patents/US20060046468?utm_source=gb-gplus-sharePatent US20060046468 - Through-substrate interconnect fabrication methods and resulting structures and assemblies
