A packaged integrated circuit device with a multi-level leadframe has a plurality of integral capacitors formed by placing a thin dielectric layer between a lower leadframe and an upper leadframe, one of the leadframes being subdivided into a plurality of portions, each subdivided portion with an accessible...http://www.google.de/patents/US6310388?utm_source=gb-gplus-sharePatent US6310388 - Semiconductor die assembly having leadframe decoupling characters
