A method and apparatus for removing conductive material from a microelectronic substrate. In one embodiment, a support member supports a microelectronic substrate relative to a material removal medium, which can include first and second electrodes and a polishing pad. One or more electrolytes are disposed...http://www.google.de/patents/US7160176?utm_source=gb-gplus-sharePatent US7160176 - Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate
