A stacked package for electronic elements is provided, a plurality of stud bumps are formed on a substrate by means of a stud bump process to align with a plurality of vias of one provided electronic element. The stud bumps respectively pass through the vias and electrically connect the electronic element....http://www.google.de/patents/US20040238933?utm_source=gb-gplus-sharePatent US20040238933 - Stacked package for electronic elements and packaging method thereof
