An integrated circuit package is provided. A substrate is provided having solder openings therein and a conductive layer thereon. The conductive layer is processed to form a plurality of pads over the solder openings in the substrate. A mask is formed over the plurality of pads and openings formed in...http://www.google.de/patents/US6979907?utm_source=gb-gplus-sharePatent US6979907 - Integrated circuit package
