A method and structure is provided for preventing wetting or bleed of an adhesive, such as an epoxy, onto noble metal wire bond pads on the surface of a dielectric substrate when attaching an I/C chip to the substrate. The method includes treating the wire bond pads with a chemical composition which...http://www.google.de/patents/US6420253?utm_source=gb-gplus-sharePatent US6420253 - Method for preventing adhesive bleed onto surfaces
