A method for forming vias which pass through a semiconductor wafer substrate assembly such as a semiconductor die or wafer allows two different types of connections to be formed during a single formation process. One connection passes through the wafer without being electrically coupled to the wafer,...http://www.google.de/patents/US20070178694?utm_source=gb-gplus-sharePatent US20070178694 - Pass through via technology for use during the manufacture of a semiconductor device
