A thin film forming method and apparatus, wherein a negative voltage is applied alternately to a target and a substrate to perform film formation and reverse sputter alternately. Further, a coil is mounted between the target and the substrate and a high frequency current is made to flow therethrough...http://www.google.de/patents/US5175608?utm_source=gb-gplus-sharePatent US5175608 - Method of and apparatus for sputtering, and integrated circuit device
