An interconnect for BGA packages, a BGA package fabricated using the interconnect, and a method for fabricating BGA packages using the interconnect, are provided. The interconnect includes multiple polymer substrates on which patterns of conductors are formed. Each substrate can be used to fabricate...http://www.google.de/patents/US6232666?utm_source=gb-gplus-sharePatent US6232666 - Interconnect for packaging semiconductor dice and fabricating BGA packages
