Microelectronic imager assemblies with front side contacts and methods for fabricating such microelectronic imager assemblies are disclosed herein. In one embodiment, a microelectronic imager assembly comprises a workpiece including a substrate having a front side and a backside. The assembly further...http://www.google.de/patents/US20060044433?utm_source=gb-gplus-sharePatent US20060044433 - Microelectronic imagers having front side contacts and methods of packaging such microelectronic imagers
