A multidie semiconductor device assembly or package includes an interposer comprising a substrate with at least one receptacle therethrough. A plurality of semiconductor device components (e.g., semiconductor devices) may be assembled with the interposer. For example, at least one contact pad of a semiconductor...http://www.google.de/patents/US20050218518?utm_source=gb-gplus-sharePatent US20050218518 - Semiconductor device assemblies and packages including multiple semiconductor device components
