The present invention is directed to the process of forming a multi-layer or hybrid circuit assembly. The assembly includes at least one ceramic substrate having a layer of foil bonded thereto by a high temperature organic adhesive. The foil may be etched and have a resistive metal alloy tape can be...http://www.google.de/patents/US4696851?utm_source=gb-gplus-sharePatent US4696851 - Hybrid and multi-layer circuitry
