A flip chip on chip assembly including a first flip chip; a second flip chip directly connected to the top of the first flip chip; and electrically conductive epoxy means disposed between the second flip chip and the top of the first flip chip to form an electrical connection between the first flip chip...http://www.google.de/patents/US6271598?utm_source=gb-gplus-sharePatent US6271598 - Conductive epoxy flip-chip on chip
