A semiconductor device includes a wiring layer that is formed on a substrate and includes a first pad contact region and a second pad contact region, a passivation layer that includes a first opening and a second opening on the wiring layer and a protrusion pattern dividing the first opening and the...http://www.google.de/patents/US20080093596?utm_source=gb-gplus-sharePatent US20080093596 - Semiconductor Device and Method of Fabricating the Same
