A mask having a plurality of through holes and a mold having a plurality of cavities are provided, and the through holes and the cavities are aligned. Conductive balls are dispensed into the aligned through holes and cavities Substantially one ball is dispensed into each aligned through hole and cavity,...http://www.google.de/patents/US7780063?utm_source=gb-gplus-sharePatent US7780063 - Techniques for arranging solder balls and forming bumps
