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United States Patent

[19]

Kim et al.

US005916858A [ii] Patent Number: [45] Date of Patent:

5,916,858 Jun. 29,1999

[54] LIQUID AND METHOD TO CLEAN METAL MASKS FOR SURFACE MOUNTING TECHNOLOGY

[75] Inventors: Choul-Su Kim; Woo-Sig Kim;

Masaharu Tsukue, all of Suwon, Rep. of Korea

[73] Assignee: SamSung Electronics Co., Ltd.,

Suwon, Rep. of Korea

[21] Appl. No.: 08/864,119

[22] Filed: May 28, 1997

[30] Foreign Application Priority Data

Jul. 19, 1996 [KR] Rep. of Korea 96 29277

[51] Int. CI.6 CUD 3/43; C23G 5/02

[52] U.S. CI 510/175; 510/176; 510/407;

510/412; 510/413; 134/1.3; 134/26

[58] Field of Search 510/175, 176,

510/407, 412, 413, 414; 134/1.3, 34.2, 26, 38, 40, 42

[56] References Cited

U.S. PATENT DOCUMENTS

3,723,332 3/1973 Barton 252/171

4,018,689 4/1977 Thompson 252/8.55 C

4,440,653 4/1984 Briscoe et al 252/8.55 R

4,606,842 8/1986 Keyes et al 252/174.23

4,847,004 7/1989 McLeod 252/527

4,971,083 11/1990 Stach et al 134/57 R

5,011,713 4/1991 Lentietal 427/393.6

5,023,010 6/1991 Merchant 252/171

5,043,088 8/1991 Falla 252/70

5,238,504 8/1993 Henry 134/40

5,250,213 10/1993 Rozen et al 252/162

5,271,775 12/1993 Asano et al 134/40

5,271,861 12/1993 Buchwald et al 252/153

5,302,313 4/1994 Asano et al 252/171

5,456,760 10/1995 Goehausen 134/42

5,593,504 1/1997 Cala et al 134/1

OTHER PUBLICATIONS

McCutcheon's, vol. 1: Emulsifiers & Detergents, North American Edition, p. 83, #-97.

Sharovarnikov, A.F., et al., "Surface activity of fluorinecontaining surfactants in polar solvents and water-organic mixtures", Kolloidn. Zh., 53(5), 949-954, #-91. Shah, Khalid M., et al., "Change your surfactant formula and use etch baths for a week", Semicond. Int., 11(11), 132-134, #-88.

# Month not available.

Primary Examiner—Mark Kopec

Assistant Examiner—Gregory E. Webb

Attorney, Agent, or Firm—Robert E. Bushnell, Esq.

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A method for washing metal masks using a cleaning liquid includes the steps of washing the metal masks before a solder printing process on printed circuit boards, washing the metal masks at least once during the solder printing process and washing the metal masks after completing the last solder printing process. The washing liquid has a composition consisting of from 1 to 5% by weight of a ffuorine43ased surfactant and from 95 to 99% by weight of isopropyl alcohol, the some of the constituents being 100% by weight. More preferably, the cleaning liquid is a composition consisting of 2% by weight of the ffuorine43ased surfactant and 98% by weight of isopropyl alcohol, the some of the constituents being 100% by weight.

4 Claims, 4 Drawing Sheets

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